Sandisk Corporation (Nasdaq: SNDK) and SK hynix Inc. today announced the release of the HBF™ (High Bandwidth Flash) technical specification through the Open Compute Project (OCP), advancing the workstream to drive HBF standardization for the AI inference era, just six months after the consortium began work in February 2027.
Will NAND memory chip price raise (Q/Q) again in 1Q2027?
Will be based on industry consultant's sources such as TrendForce
Key remarks by the companies are as below:
First HBF standard showcased within six months of consortium launch, expanding the ecosystem with participation from Google, Tenstorrent
Keynote by SK hynix Executive Vice President Kim Chun-sung and Vice President Kang Uk-song on opening day, offering solutions for next-generation AI infrastructure based on ‘Tiered Memory’
“Expanding the boundaries of memory and storage through HBF technology… contributing to new architectures that boost system efficiency”
Source:
- Sandisk press release; https://www.businesswire.com/news/home/20260803297696/en/Sandisk-and-SK-hynix-Advance-Global-Standardization-of-High-Bandwidth-Flash-with-Release-of-First-OCP-Technical-Specification
- SK Hynix press release; https://news.skhynix.com/en/hbf-at-fms-2026/
- Yahoo Finance; https://finance.yahoo.com/technology/ai/articles/sandisk-sndk-sk-hynix-release-011325591.html
