Teach-in Series 7 - OEM/Brands
Where chips become products — and the demand that pulls the whole chain
Teach-in Series 6 - OSAT & Advanced Packaging
Assembly, test, and the packaging revolution reshaping the back end Executive summary OSAT — outsourced semiconductor assembly and test — firms take finished wafers and turn them into packaged, tested chips. Historically the lowest-margin link in the chain, the back end has been transformed by advanced packaging: chiplets, 2.5D/3D
Teach-in Series 5 - Foundries
The contract chip manufacturers — and TSMC’s extraordinary dominance
Teach-in Series 4 - Fabless & System Companies
The chip designers — and the system makers now designing their own silicon.
