Semi Subpage Teach In
Teach-in Series 7 - OEM/Brands
Where chips become products — and the demand that pulls the whole chain
Teach-in Series 6 - OSAT & Advanced Packaging
Assembly, test, and the packaging revolution reshaping the back end Executive summary OSAT — outsourced semiconductor assembly and test — firms take finished wafers and turn them into packaged, tested chips. Historically the lowest-margin link in the chain, the back end has been transformed by advanced packaging: chiplets, 2.5D/3D
Teach-in Series 5 - Foundries
The contract chip manufacturers — and TSMC’s extraordinary dominance
Teach-in Series 4 - Fabless & System Companies
The chip designers — and the system makers now designing their own silicon.
Teach-in Series 3 - IDM
Companies that design and manufacture their own chips — memory, analog, power, and Intel.
Teach-in Series 2 - EDA & IP
The design-enabler layer of the chip economy — the software and reusable IP that make every chip possible. A companion to the Equipment & Materials primer.
Teach-in Series 1 - Semiconductor Equipment & Materials
The capital-equipment and materials layer that enables all semiconductor manufacturing — its structure, economics, leaders, and strategic risks.
