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Tech

Breaking News - SK Hynix US Offering Is More Than Seven Times Oversubscribed

SK Hynix Inc.'s US listing is more than seven times oversubscribed, according to people familiar with the matter, as the South Korean memory chipmaker prepares to price its offering Thursday.

Silicon Bakery - Apple interest thrusts China’s CXMT into memory chip spotlight

CXMT has been thrust into the global spotlight by the race for memory chips. Apple has begun testing the company’s DRam chips for devices sold in China, according to two people familiar with the matter

AI Speedrun - Anthropic vs Meta: Two Compute Signals, One Confusing Week

Two headlines landed within days of each other and appear to point in opposite directions: Anthropic locking up two decades of dedicated data-center capacity, while Meta suggesting it has AI compute to spare -- analysts, investors, and the companies themselves haven't settled on one story.

Volts to Intelligence - Meta’s AI Cloud Pivot: Monetization Strategy or Overbuild Signal?

Bloomberg (July 1) - Meta is reportedly developing a cloud infrastructure business that would sell access to AI computing power and models to outside customers. The plan could put Meta into a new competitive lane against cloud leaders such as Amazon Web Services, Microsoft Azure, and Google Cloud. The business would

Embodied AI - How a Magnet Shortage Is Throttling Western Humanoid Ambitions

In April 2025, Elon Musk revealed that Optimus production had stalled over a magnet problem: Tesla was waiting on a Chinese export license for the rare-earth magnets that drive one of the robot's arm actuators. It was an unusually specific admission, and it pointed at a dependency

Volts to Intelligence - Next AI Energy Trade: More Power VS More Value per Watt

Brief summary of "Why the world's biggest battery maker isn't worried about AI's energy demand" and extended analysis

Market Rumor - OpenAI proposes handing Trump administration 5% stake

According to FT, Sam Altman’s start-up in early talks for a public ownership deal as political pressure rises.

Teach-in Series 7 - OEM/Brands

Where chips become products — and the demand that pulls the whole chain

Teach-in Series 6 - OSAT & Advanced Packaging

Assembly, test, and the packaging revolution reshaping the back end Executive summary OSAT — outsourced semiconductor assembly and test — firms take finished wafers and turn them into packaged, tested chips. Historically the lowest-margin link in the chain, the back end has been transformed by advanced packaging: chiplets, 2.5D/3D

Teach-in Series 5 - Foundries

The contract chip manufacturers — and TSMC’s extraordinary dominance

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